Breakthrough Technology in Semiconductor Industry Manufacturing
TFI has created a functional Demo Prototype for clients to help develop their specific requirements that will be in the Global HQ and Demo Sales Lab in Irvine California this year. TFI already has interested Device Makers, manufacturers in several countries awaiting this game changing opportunity.
Two manufacturing sites: R&D/demo lab to be operated in California for USA & European customers and one for South Korea for the Asian market.
It's going to take about 10 ~ 12 weeks from the investment fund raising goal reached in USA.
TFI's process uses chemicals fully proven for safety, and being non-toxic-- and can be diluted 100% without residue, dust, sludge deposits, air contamination, etc. The State of California has already had discussions and reviews on fast tracking permits and licenses for TFI.
Stack Vertically semiconductor devices(Memory, System IC, CPU, GPU..) to increase capacity on limited space
New technology to interconnect device to device, chip to chip through vertical hole filled by Conductor (Cu:Copper) for semiconductors, display products.